STAYCHIP
associated with 44 other trademarks
UNDERFILL AND ENCAPSULANT MATERIALS, NAMELY THERMOPLASTIC OR THERMOSET POLYMERIC MATERIALS USED IN ASSEMBLY OF PRINTED CIRCUIT BOARDS OR SEMICONDUCTOR...

Words that describe this trademark:

printed circuit boards  materials used  polymeric materials  used  underfill  assembly  thermoset  materials  thermoplastic  encapsulant 

Serial Number:

76068543

Mark:

STAYCHIP

Status:

Cancelled-Section 8

Status Date:

02-06-2010

Filing Date:

Registration Number:

2731081

Registration Date:

07-01-2003

Goods and Services:

UNDERFILL AND ENCAPSULANT MATERIALS, NAMELY THERMOPLASTIC OR THERMOSET POLYMERIC MATERIALS USED IN ASSEMBLY OF PRINTED CIRCUIT BOARDS OR SEMICONDUCTOR PACKAGING

Mark Description:

N/A

Class:

Rubber

Type of Mark:

Trademark

Published for Opposition Date:

04-08-2003

Mark Drawing Status:

Typed Drawing

Abandon Date:

N/A

Business Name:

COWAN, LIEBOWITZ & LATMAN PC

Correspondent Name:

Recent Trademark filings by this company