Serial Number:
85242483
Mark:
LIQUI-PAD
Status:
Abandoned-No Statement of Use filed
Status Date:
06-01-2015
Filing Date:
Registration Number:
N/A
Registration Date:
N/A
Electrically insulative, thermally conductive chemical interface compounds for mounting electronic devices onto computer chassis, computer heat sinks, heat sinks for use in electronic components, or printed circuitry boards
Mark Description:
N/A
Class:
Chemicals
Type of Mark:
Trademark
Published for Opposition Date:
09-04-2012
Owner:
Mark Drawing Status:
Standart Character Mark
Abandon Date:
06-01-2015
Business Name:
HAUGEN LAW FIRM PLLP
Correspondent Name:
