CHO-BOND
associated with 427 other trademarks
ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVES, CONSISTING OF METAL-FILLED RESINS, FOR USE IN ACHIEVING ELECTRICAL CONTINUITY OR THERMAL DISSIPATION ...

Words that describe this trademark:

thermally conductive adhesives  conductive adhesives  electrical continuity  thermal dissipation  resins  achieving  electrically  consisting  adhesives  continuity 

Serial Number:

72333332

Mark:

CHO-BOND

Status:

Renewed

Status Date:

07-02-2020

Filing Date:

Registration Number:

889305

Registration Date:

04-14-1970

Goods and Services:

ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVES, CONSISTING OF METAL-FILLED RESINS, FOR USE IN ACHIEVING ELECTRICAL CONTINUITY OR THERMAL DISSIPATION AT JOINTS

Mark Description:

N/A

Class:

Household or kitchen utensils and containers

Type of Mark:

Trademark

Published for Opposition Date:

N/A

Mark Drawing Status:

Typed Drawing

Abandon Date:

N/A

Business Name:

PARKER-HANNIFIN CORPORATION

Correspondent Name:

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